Advanced Electronic Packaging / Aufbau- und Verbindungstechnik II
Participation
If you would like to attend the lecture, please register by sending an email to Ms. Vera Winterhalder.
Important: Please use your university e-mail address. Please provide the following information when registering:
- Name
- Matriculation number
- Number of semesters
- Area of specialisation
Lecturer
Prof. Dr.-Ing. habil. Steffen Wiese
Aims / Competences to be developed
Based on selected publications from international journals or chapters from specialist books current developments in advanced electronic packaging, fundamental material-physical mechanisms in connection systems are to be presented in a lecture and discussed among the seminar participants. The aim of the event is to deal with topics beyond basic education as well as acquire skills in the presentation of scientific-technical issues.
Content
- Background of high pincounts
- Electrical and Thermal Issues in Electronic Packaging
- Specific Surfaces and Joining Technologies
- Area Array Components
- Bumping Technologies and Flip-Chip-Packages
- From Ball Grid Array Packages to Chip Size Packages
- Chip Stacking and other System in Package approaches
- Green Packaging Technologies
Lecture
148902
Wednesday, 12:00 - 14:00 h
xx.xx.2025 - xx.xx.2025
Building A5 1, room -1.22 (lecture hall II)
Prof. Dr.-Ing. habil. Steffen Wiese
Exercise
Wednesday, 14:00 - 15:00 h
Building A5 1, room -1.22 (lecture hall II)
Prof. Dr.-Ing. habil. Steffen Wiese
Exam
Term will be announced
Please note that it is necessary to register for this exam at least one week before the date via your log-in. If that is not possible please sign in at the exam secretariat:
Gemeinsames Prüfungssekretariat der NTF der UdS
Gebäude E1 3, Raum 202
Telefon: +49 (0) 681 302 5003
- Tasks are solved on exercise sheets provided by the chair
- Calculators are provided (CASIO FX-82Solar II)
- Exercise sheets must be completed in ink